features trenchfet power mosfet 175 c junction temperature pwm optimized for high efficiency applications high-side synchronous buck dc/dc conversion - desktop - server SUD50N02-12P vishay siliconix document number: 72095 s-31269?rev. b, 16-jun-03 www.vishay.com 1 n-channel 20-v (d-s) 175 c mosfet product summary v ds (v) r ds(on) ( ) i d (a) a 20 0.012 @ v gs = 10 v 40 c 20 0.026 @ v gs = 4.5 v 27 c d g s n-channel mosfet to-252 s gd top view drain connected to tab order number: SUD50N02-12P absolute maximum ratings (t a = 25 c unless otherwise noted) parameter symbol limit unit drain-source voltage v ds 20 v gate-source voltage v gs 20 v continuous drain current a t c = 25 c i d 40 c continuous drain current a t c = 100 c i d 28 c a pulsed drain current i dm 90 a continuous source current (diode conduction) a i s 4 maximum power dissipation t c = 25 c p d 33.3 w maximum power dissipation t a = 25 c p d 6 a w operating junction and storage temperature range t j , t stg - 55 to 175 c thermal resistance ratings parameter symbol typical maximum unit maximum junction to ambient a t 10 sec r 20 25 maximum junction-to-ambient a steady state r thja 40 50 c/w maximum junction-to-case r thjc 3.7 4.5 c/w notes a. surface mounted on fr4 board, t 10 sec. b. limited by package c. based on maximum allowable junction temperature. package limitation current is 30 a.
SUD50N02-12P vishay siliconix www.vishay.com 2 document number: 72095 s-31269?rev. b, 16-jun-03 specifications (t j = 25 c unless otherwise noted) parameter symbol test condition min typ a max unit static drain-source breakdown voltage v (br)dss v gs = 0 v, i d = 250 a 20 v gate threshold voltage v gs(th) v ds = v gs , i d = 250 a 0.8 3.0 v gate-body leakage i gss v ds = 0 v, v gs = 20 v 100 na zero gate voltage drain current i dss v ds = 16 v, v gs = 0 v 1 a zero gate voltage drain current i dss v ds = 16 v, v gs = 0 v, t j = 125 c 50 a on-state drain current b i d(on) v ds = 5 v, v gs = 10 v 50 a v gs = 10 v, i d = 20 a 0.0095 0.012 drain-source on-state resistance b r ds(on) v gs = 10 v, i d = 20 a, t j = 125 c 0.0143 drain source on state resistance r ds(on) v gs = 4.5 v, i d = 15 a 0.021 0.026 forward transconductance b g fs v ds = 15 v, i d = 20 a 10 s dynamic a input capacitance c iss 1000 output capacitance c oss v gs = 0 v, v ds = 10 v, f = 1 mhz 370 pf reverse transfer capacitance c rss 180 p gate resistance r g 3.0 total gate charge c q g 7.5 12 gate-source charge c q gs v ds = 10 v, v gs = 4.5 v, i d = 50 a 3.5 nc gate-drain charge c q gd v ds 10 v, v gs 4.5 v, i d 50 a 2.6 nc turn-on delay time c t d(on) 11 20 rise time c t r v dd = 10 v, r l = 0.2 10 15 ns turn-off delay time c t d(off) v dd = 10 v , r l = 0 . 2 i d 50 a, v gen = 10 v, r g = 2.5 24 35 ns fall time c t f 9 15 source-drain diode ratings and characteristic (t c = 25 c) pulsed current i sm 100 a diode forward voltage b v sd i f = 50 a, v gs = 0 v 1.1 1.5 v source-drain reverse recovery time t rr i f = 50 a, di/dt = 100 a/ s 20 40 ns notes a. guaranteed by design, not subject to production testing. b. pulse test; pulse width 300 s, duty cycle 2%. c. independent of operating temperature. typical characteristics (25 c unless noted) 0 15 30 45 60 75 90 0246810 0 15 30 45 60 75 90 01234567 output characteristics transfer characteristics v ds - drain-to-source voltage (v) - drain current (a) i d v gs - gate-to-source voltage (v) - drain current (a) i d 25 c 125 c t c = - 55 c 3 v 4 v 5 v 6 v v gs = 10 thru 7 v
SUD50N02-12P vishay siliconix document number: 72095 s-31269?rev. b, 16-jun-03 www.vishay.com 3 typical characteristics (25 c unless noted) 0.000 0.005 0.010 0.015 0.020 0.025 0.030 0.035 0.040 0 153045607590 0 2 4 6 8 10 0 4 8 12 16 0 300 600 900 1200 1500 048121620 capacitance gate charge transconductance on-resistance vs. drain current - gate-to-source voltage (v) - on-resistance ( q g - total gate charge (nc) i d - drain current (a) v ds - drain-to-source voltage (v) c - capacitance (pf) r ds(on) ) v gs - transconductance (s) g fs v ds = 10 v i d = 50 a v gs = 10 v v gs = 4.5 v c rss 125 c c iss i d - drain current (a) c oss (normalized) - on-resistance ( r ds(on) ) 0.6 0.8 1.0 1.2 1.4 1.6 1.8 - 50 - 25 0 25 50 75 100 125 150 175 on-resistance vs. junction t emperature source-drain diode forward voltage t j - junction temperature ( c) v sd - source-to-drain voltage (v) - source current (a) i s 100 1 0.3 0.6 0.9 1.2 1.5 v gs = 10 v i d = 30 a t j = 25 c t j = 150 c 0 10 0 10 20 30 40 50 0 1020304050 25 c t c = - 55 c
SUD50N02-12P vishay siliconix www.vishay.com 4 document number: 72095 s-31269?rev. b, 16-jun-03 thermal ratings 0 4 8 12 16 20 0 25 50 75 100 125 150 175 safe operating area v ds - drain-to-source voltage (v) - drain current (a) i d 1000 10 0.01 0.1 1 10 100 1 100 t a = 25 c single pulse normalized thermal transient impedance, junction-to-ambient square wave pulse duration (sec) 2 1 0.1 0.01 10 -4 10 -3 10 -2 10 -1 110 normalized effective transient thermal impedance maximum drain current vs. ambiemt t emperature t a - ambient temperature ( c) - drain current (a) i d 0.2 0.1 0.05 0.02 single pulse duty cycle = 0.5 1 ms 10 ms 100 ms dc 10, 100 s 1 s 1000 100 0.1 10 s 100 s limited by r ds(on)
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